HFD-PCD (Diamond Micron Powder Specialized for PCD)
Product Characteristics: Made of higher toughness MBD diamond, treated by special processing and with purified diamond surface; blocky shape, good thermal stability and high wear-resistance. Good for sintering growth of PDC and PCD.
Recommended Applications: PDC, PCD, wiring dies, electroplating, vitrified & metal bonded tools, etc.
HFD-BR (Diamond Micron Powder Specialized for Abrasive Brick)
Product Characteristics: Made of high quality diamond, processed by special processing; irregular particle shape & multi-edge with high sharpening performance; the nice feature is: a tough retention with bond so as to enhance wear-resistance and extend working life.
Recommended applications: Resin bond flexible Diamond Abrasive Brick.
HFD-DW (Diamond Micron Powder Specialized for Diamond Wire)
Product Characteristics: Made of high toughness MBD diamond, treated by special re-shaping and grading, strictly removing oversize particles; good particle morphology and strictly narrow PSD, high content of effective grinding particles to enhance wear- resistance.
Recommended Applications: Making diamond wire and other cutting tools; grinding and polishing on: monocrystalline and polycrystalline silicon, precious stones, quartz, LCD glass, magnetic materials, semiconductors and other hard and friable material.